
QUESTION:
What is the recommended minimum bond line thickness?
ANSWER:
A general guideline for minimum bond line thickness is between 25 to 150 microns (1 to 6 mils) – as a starting point. I recommend you choose a certain level to start, then make a few thicker and thinner versions of the bond. Take time to inspect completed bonds carefully to learn how a bond can fail, evaluate the performance for your application, and adjust bond line thickness as necessary to achieve a quality bond.
For every application, bond line thickness depends on:
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The geometry of the bond area
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The substrates being bonded
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The material itself (the epoxy’s chemistry can dictate a specific minimum bond line thickness)
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The temperature cycling the bond will need to survive
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Proper surface preparation (improper cleaning can negate adhesion)
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The cure time and method of cure
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Bond line thickness and curing time go hand-in-hand to achieve sufficient adhesion and performance. Carefully review the epoxy manufacturer’s datasheet, including any charts showing bond line thickness versus cure time for the various curing methods.
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READ THE FULL BLOG ARTICLE HERE: Bond Line Thickness & More: Answers to Common Epoxy Questions
ADDITIONAL CONTENT & RESOURCES:
- Category Resource: FOC Epoxy Page
- Find More Information in this Blog: Helpful Epoxy Tips (and a Few Tricks)

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