Cometx-Ssp Laser Cleaving System for Single and Multi-Fiber Connectors
Request a quote for the Sagitta CometX-SSP here.
The CometX-SSP enables efficient and quick laser cleaving of the fiber after the epoxy curing step. The cleaving is non-contact resulting in zero chips or cracks and provides the best post-cleave conditions for the most efficient polishing process. However, to achieve an extremely efficient process other factors also need to be considered. These include the quality of the connector’s pre-polished geometry, pre-radius and surface quality. When all aspects are addressed a single diamond step polishing process is possible, and in some instances, a process without a diamond might be attenable. Please contact our technical team for further details.
Benefits
- Single polishing step
- Laser cleaving eliminates operator/tool-dependent cleave quality
- Eliminates cleave-related multimode fiber core cracking
- Minimal epoxy “pond” left
- Short and simple polishing process (around 1 min/batch)
- Minimal use of polishing equipment and materials
- Higher yield and throughput; Remove interdependencies
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